Osaka, Japan

Yohei Ohkawa

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Nippon Pillar Packing Co., Ltd.. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yohei Ohkawa. Retrieved from https://idiyas.com/inventor/yohei-ohkawa

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Yohei Ohkawa: Innovator in Sleeve Technology

Introduction

Yohei Ohkawa is a notable inventor based in Osaka, Japan. He has made significant contributions to the field of engineering, particularly with his innovative designs. His work has led to the development of a unique patent that showcases his expertise and creativity.

Latest Patents

Yohei Ohkawa holds a patent for a Sleeve, which demonstrates his ability to create practical solutions in his industry. This invention reflects his commitment to advancing technology and improving existing products.

Career Highlights

Ohkawa is currently employed at Nippon Pillar Packing Co., Ltd., where he applies his skills and knowledge to further the company's mission. His role at the company allows him to collaborate with other talented professionals and contribute to various projects.

Collaborations

Some of his coworkers include Ayumi Kurosaki and Shingo Higuchi. Together, they work on innovative projects that push the boundaries of technology and engineering.

Conclusion

In summary, Yohei Ohkawa is a dedicated inventor whose work in sleeve technology has made a significant impact. His contributions to Nippon Pillar Packing Co., Ltd. and collaborations with talented colleagues highlight his importance in the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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