Kyoto, Japan

Yohei Murakami

This inventor holds 1 USPTO granted patent. Top assignee: Nitta Haas Inc.. Active years: 2020.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yohei Murakami. Retrieved from https://idiyas.com/inventor/yohei-murakami-enp2tq9t

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2020

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1 patent (USPTO):Explore Patents

Title: Yohei Murakami: Innovator in Polishing Technology

Introduction

Yohei Murakami is a notable inventor based in Kyoto, Japan. He has made significant contributions to the field of polishing technology. His innovative approach has led to the development of a unique polishing pad that enhances efficiency in various applications.

Latest Patents

Murakami holds a patent for a polishing pad formed by foamed polyurethane. This invention features a content of S phase in the foamed polyurethane, as determined by pulsed NMR measurement at 25°C, exceeding 70%. This advancement is crucial for improving the performance and durability of polishing processes.

Career Highlights

Murakami is associated with Nitta Haas Inc., where he continues to push the boundaries of polishing technology. His work has garnered attention for its practical applications in various industries, showcasing his expertise and dedication to innovation.

Collaborations

He has collaborated with notable colleagues, including Nobuyuki Oshima and Hiroyuki Nakano. These partnerships have further enriched his work and contributed to the development of advanced polishing solutions.

Conclusion

Yohei Murakami's contributions to polishing technology through his innovative patent exemplify the impact of dedicated inventors in advancing industry standards. His work continues to influence the field and inspire future innovations.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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