Company Filing History:
Years Active: 2001-2002
Title: Innovations of Yogesh M Desai
Introduction
Yogesh M Desai is a prominent inventor based in San Jose, CA (US). He has made significant contributions to the field of microelectronics, holding a total of 4 patents. His work focuses on innovative packaging solutions for micro devices, enhancing their performance and reliability.
Latest Patents
One of his latest patents is the Microcap Wafer-Level Package. This invention provides a microcap wafer-level package in which a micro device is connected to bonding pads on a base wafer. A peripheral pad on the base wafer encompasses the bonding pads and the micro device. The cap wafer has gaskets formed using a thick photoresist semiconductor photolithographic process. Bonding pad gaskets match the perimeters of the bonding pads, while a peripheral pad gasket matches the peripheral pad on the base wafer. Wells are located inside the perimeters of the bond pad gaskets and are formed to a predetermined depth in the cap wafer. The cap wafer is then placed over the base wafer to cold weld bond the gaskets to the pads, forming a hermetically sealed volume between the bonding pad gaskets and the peripheral pad gasket. The cap wafer is then thinned below the predetermined depth until the wells become through holes that provide access to the bonding pads inside the package, but outside the hermetically sealed volume, for connecting wires from a micro device utilizing system.
Career Highlights
Yogesh M Desai is currently employed at Agilent Technologies, Inc., where he continues to innovate and develop advanced technologies. His work has significantly impacted the microelectronics industry, particularly in the area of packaging solutions.
Collaborations
He has collaborated with notable coworkers, including Richard C Ruby and Tracy E Bell, contributing to various projects and advancements in their field.
Conclusion
Yogesh M Desai's contributions to microelectronics through his innovative patents and collaborations highlight his role as a leading inventor in the industry. His work continues to pave the way for advancements in micro device packaging solutions.