Shanghai, China

Yizhen Wang

This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: Henkel Ag & Company, Kgaa. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yizhen Wang. Retrieved from https://idiyas.com/inventor/yizhen-wang-qno80qwh

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

 

Average Co-Inventor Count = 6.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Yizhen Wang: Innovator in Thermally Conductive Silicone Potting Composition

Introduction

Yizhen Wang is a prominent inventor based in Shanghai, China. She has made significant contributions to the field of materials science, particularly in the development of thermally conductive silicone potting compositions. Her innovative work has garnered attention in both academic and industrial circles.

Latest Patents

Yizhen Wang holds a patent for a thermally conductive silicone potting composition. This invention provides a unique solution for applications requiring effective thermal management. The composition is designed to enhance the thermal conductivity of electronic components, ensuring their reliability and performance.

Career Highlights

Yizhen Wang is currently employed at Henkel AG & Company, KGaA, where she continues to advance her research and development efforts. Her work at Henkel has allowed her to collaborate with leading experts in the field and contribute to innovative product solutions.

Collaborations

Yizhen has worked alongside talented colleagues, including Wentao Xing and Hao Wu. These collaborations have fostered a dynamic environment for innovation and have led to the successful development of new materials and technologies.

Conclusion

Yizhen Wang's contributions to the field of thermally conductive materials exemplify her dedication to innovation. Her work not only enhances product performance but also paves the way for future advancements in materials science.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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