Singapore, Singapore

Yixin Chew


Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 55(Granted Patents)


Company Filing History:


Years Active: 2006

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1 patent (USPTO):Explore Patents

Title: Yixin Chew: Innovator in Semiconductor Packaging Technology

Introduction

Yixin Chew is a notable inventor based in Singapore, recognized for his contributions to semiconductor packaging technology. He has developed innovative methods that enhance the efficiency and reliability of flip chip packages. His work is particularly significant in the context of modern electronics, where miniaturization and performance are paramount.

Latest Patents

Yixin Chew holds a patent for a method of fabricating a flip chip package with pillar bump and no flow underfill. This invention details a technique for joining a semiconductor integrated circuit (IC) chip in a flip chip configuration using pillar bumps. The method allows for the attachment of the semiconductor device to a substrate via no flow underfill under thermal compression bonding. This innovative approach enables the incorporation of low coefficient of thermal expansion (CTE) no flow underfill, achieving high assembly yield, especially for lead-free bumps. The invention addresses the challenges of fine pitch, high pin count, and lead-free requirements in flip chip packaging.

Career Highlights

Yixin Chew is currently employed at Advanpack Solutions Pte Ltd., where he continues to advance semiconductor packaging technologies. His expertise in this field has positioned him as a key player in developing solutions that meet the evolving demands of the electronics industry.

Collaborations

Yixin collaborates with talented colleagues, including Tie Wang and Ping Miao, who contribute to the innovative environment at Advanpack Solutions Pte Ltd. Their combined efforts foster a culture of creativity and technical excellence.

Conclusion

Yixin Chew's contributions to semiconductor packaging technology exemplify the importance of innovation in the electronics sector. His patented methods not only enhance product performance but also address critical industry challenges. Through his work, Yixin continues to make a significant impact on the future of semiconductor technology.

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