Singapore, Singapore

Yiu Wai Lai

This inventor holds 1 USPTO granted patent. Top assignee: Delta Electronics Int'l (Singapore) Pte Ltd. Active years: 2017.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yiu Wai Lai. Retrieved from https://idiyas.com/inventor/yiu-wai-lai-mdfgoudf

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 2017

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1 patent (USPTO):Explore Patents

Title: Yiu Wai Lai: Innovator in Semiconductor Packaging

Introduction

Yiu Wai Lai is a notable inventor based in Singapore, recognized for his contributions to the field of semiconductor packaging. With a focus on innovative methods, he has developed a unique approach that enhances the efficiency and reliability of semiconductor devices. His work is pivotal in advancing technology in this critical area.

Latest Patents

Yiu Wai Lai holds a patent for a method of packaging semiconductor devices. This patent describes a process that involves several key steps. A first insulation layer comprising stacked prepreg layers is provided, and a metallic protective layer is formed on this first insulation layer. A first alignment mark is created on the first insulation layer, followed by the formation of an accommodation cavity based on this alignment mark. A second alignment mark is also established according to the first alignment mark. A carrier plate is then attached to the first insulation layer using a thermal release tape layer, allowing the semiconductor device to be temporarily fixed within the accommodation cavity according to the second alignment mark. Subsequently, a semi-cured second insulation layer is placed over the first insulation layer, which is then laminated and cured. Finally, a re-distribution layer is formed on the second insulation layer, establishing an electrical connection with the semiconductor device. This innovative method significantly improves the packaging process of semiconductor devices.

Career Highlights

Yiu Wai Lai is currently employed at Delta Electronics International (Singapore) Pte Ltd, where he continues to contribute to advancements in semiconductor technology. His expertise and innovative mindset have made him a valuable asset to the company.

Collaborations

Throughout his career, Yiu Wai Lai has collaborated with several talented individuals, including Xiaofeng Xu and Beng Beng Lim. These collaborations have fostered a creative environment that encourages the development of groundbreaking technologies.

Conclusion

Yiu Wai Lai's contributions to semiconductor packaging exemplify the spirit of innovation in technology. His patent and ongoing work at Delta Electronics International highlight his commitment to advancing the field. As he continues to collaborate with other experts, his impact on the industry is sure to grow.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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