Guangdong, China

Yiping Shi

This inventor holds 3 USPTO granted patents. Top assignee: Shenzhen Everwin Precision Technology Co., Ltd.. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yiping Shi. Retrieved from https://idiyas.com/inventor/yiping-shi-pchwyryu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.5

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2025

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3 patents (USPTO):Explore Patents

Title: Yiping Shi: Innovator in Board-to-Board Socket Technology

Introduction

Yiping Shi is a prominent inventor based in Guangdong, China. He has made significant contributions to the field of socket technology, holding a total of 3 patents. His innovative designs focus on enhancing the functionality and reliability of board-to-board connections.

Latest Patents

Yiping Shi's latest patents include a board-to-board socket that features a comprehensive design comprising a socket body, socket terminal, and a socket reinforcing member. The socket body is constructed with a bottom wall and side walls that provide structural integrity. Additionally, the socket guide parts facilitate the insertion of plugs, ensuring a secure connection. Another notable patent is the socket strengthener, which enhances the durability of the board-to-board socket and connector assembly. This invention includes elastic arm parts that improve the overall performance of the socket.

Career Highlights

Yiping Shi is currently employed at Shenzhen Everwin Precision Technology Co., Ltd. His work at this company has allowed him to focus on developing advanced socket technologies that meet the demands of modern electronic applications. His innovative approach has positioned him as a key player in the industry.

Collaborations

Yiping Shi collaborates with talented individuals such as Xiaoshuo Chen and Yingyue Li. Their combined expertise contributes to the successful development of cutting-edge technologies in the field.

Conclusion

Yiping Shi's contributions to board-to-board socket technology demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of engineering principles and a drive to improve electronic connectivity.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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