Yingqiang Yan

Title: Innovations of Yingqiang Yan in Fan-Out Packaging Technology.

Introduction

Yingqiang Yan is a notable inventor based in Shenzhen, China. He has made significant contributions to the field of packaging technology, particularly with his innovative fan-out packaging method. His work has implications for the electronics industry, enhancing the efficiency and effectiveness of electronic component packaging.

Latest Patents

Yingqiang Yan holds a patent for a fan-out packaging method and fan-out packaging plate. This method involves preparing circuit patterns on one or both sides of a substrate and installing electronic parts accordingly. The packaging layers, made of a thermal-plastic material, encapsulate the substrate, circuit patterns, and electronic parts. The design includes a via hole that allows communication between both sides of the substrate, facilitating a more integrated packaging solution.

Career Highlights

Yingqiang Yan is associated with Shenzhen Xiuyi Investment Development Partnership (Limited Partnership). His role in this company has allowed him to focus on advancing packaging technologies that are crucial for modern electronics. His innovative approach has positioned him as a key figure in the development of efficient packaging methods.

Collaborations

Yingqiang Yan collaborates with talented individuals such as Chuan Hu and Yuejin Guo. Their combined expertise contributes to the advancement of packaging technologies and the successful implementation of innovative solutions in the industry.

Conclusion

Yingqiang Yan's contributions to fan-out packaging technology demonstrate his commitment to innovation in the electronics sector. His patent reflects a significant advancement that could influence future developments in electronic component packaging.