Yingjun Pi

Title: **Innovator Spotlight: Yingjun Pi from Shenzhen, CN**

Introduction

Yingjun Pi is a prominent inventor based in Shenzhen, China. He has made significant contributions to the field of electronics through his innovative approaches to packaging methods.

Latest Patents

Yingjun holds a patent for a fan-out packaging method and fan-out packaging plate. This patent outlines a novel approach that includes preparing circuit patterns on one or both sides of a substrate, installing electronic parts on either side, and creating packaging layers that utilize thermal-plastic material. The method ingeniously incorporates a via hole to communicate both sides of the substrate, allowing parts of the packaging layers to penetrate the via hole, thereby enhancing connectivity and functionality.

Career Highlights

Yingjun Pi is affiliated with Shenzhen Xiuyi Investment Development Partnership (Limited Partnership). His work has been pivotal in pushing forward the capabilities of electronic packaging solutions, showcasing his expertise and commitment to innovation in the electronics sector.

Collaborations

Throughout his career, Yingjun has collaborated with talented individuals such as Chuan Hu and Yingqiang Yan. These partnerships have fostered a dynamic environment for creativity and advancement in their respective fields.

Conclusion

Yingjun Pi exemplifies the spirit of innovation with his dedicated work in electronic packaging methods. His patent not only reflects his ingenuity but also contributes to the broader landscape of technology, impacting various industries reliant on efficient and effective electronic solutions.