Yinghui Li

Title: Yinghui Li - Innovator in Semiconductor Packaging

Introduction

Yinghui Li is a notable inventor based in Tianjin, China. He has made significant contributions to the field of semiconductor packaging, particularly with his innovative designs and methods.

Latest Patents

Yinghui Li holds a patent for a "Stacked die semiconductor package." This invention involves a semiconductor package and a method of assembling it, which includes encapsulating a first pre-packaged semiconductor die stacked on top of and interconnected with a second semiconductor die. The first packaged semiconductor die is positioned and fixed relative to a lead frame using a temporary carrier such as tape. The second semiconductor die is attached and interconnected directly to the first packaged semiconductor die and lead frame. The interconnected first packaged die and second semiconductor die, along with the lead frame, are encapsulated to form the semiconductor package. This design allows for the formation of various types of semiconductor packages, such as quad flat no-lead (QFN) and ball grid array (BGA), which provide increased input/output (I/O) count and functionality. Yinghui Li has 1 patent to his name.

Career Highlights

Yinghui Li is currently employed at Freescale Semiconductor, Inc., where he continues to innovate in the semiconductor industry. His work has been instrumental in advancing semiconductor packaging technologies.

Collaborations

Yinghui has collaborated with notable coworkers, including Shunan Qiu and Guoliang Gong, contributing to a dynamic and innovative work environment.

Conclusion

Yinghui Li's contributions to semiconductor packaging highlight his role as an influential inventor in the field. His innovative designs and methods continue to shape the future of semiconductor technology.