This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Sichuan University. Active years: 2023.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2023
Title: Innovations of Yinghong Chen in 3D Printing Technology
Introduction
Yinghong Chen is a notable inventor based in Chengdu, China. He has made significant contributions to the field of 3D printing, particularly in enhancing thermal conductivity in printed parts. His innovative approach combines advanced materials and fabrication techniques to achieve superior results.
Latest Patents
Yinghong Chen holds a patent for a "Method for fabrication of 3D printed part with high through-plane thermal conductivity." This method involves the use of pure polymer particles and a carbon-based filler for heat conduction. The process includes milling and mixing these materials in a mechanochemical reactor under controlled conditions. The resulting mixture is extruded to create 3D printing filaments, which are then utilized in fused deposition modeling (FDM) 3D printing. This fabrication method is designed to produce parts with high thermal conductivity efficiently and is suitable for industrial applications.
Career Highlights
Yinghong Chen is affiliated with Sichuan University, where he continues to advance research in 3D printing technologies. His work emphasizes the importance of continuous production and simplicity in the manufacturing process, making it accessible for complex structures.
Collaborations
Yinghong Chen has collaborated with notable colleagues, including Shaohong Shi and Jingjing Jing. Their combined expertise contributes to the innovative research and development in the field of 3D printing.
Conclusion
Yinghong Chen's contributions to 3D printing technology demonstrate his commitment to innovation and excellence. His patented methods pave the way for advancements in thermal conductivity, showcasing the potential for industrial applications in this evolving field.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile