Shanghai, China

Yingda Liu

This inventor holds 1 USPTO granted patent. Top assignee: Huawei Technologies Co., Limited. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yingda Liu. Retrieved from https://idiyas.com/inventor/yingda-liu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 1.0

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Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Yingda Liu and Radio Frequency Channel Management

Introduction

Yingda Liu is an inventor based in Shanghai, China, associated with Huawei Technologies Co., Ltd. His patent work addresses energy efficiency in wireless communication devices.

Latest Patents

Liu is named on 1 patent: “Radio frequency channel management method, apparatus, and related device.” The invention describes a communication device with first and second carriers that identifies a target sub-frame in a downlink sub-frame. When both carriers permit the target radio frequency channel to be shut down during that sub-frame’s time period, the device switches off the channel. This sub-frame-level control is designed to reduce energy use without disrupting data communication over either carrier.

Career Highlights

Liu’s listed patent reflects work on radio frequency channel management and power-saving techniques for communication devices. His association with Huawei Technologies Co., Ltd. connects this work to the company’s wireless communications research and development.

Collaborations

Liu’s listed coworker is Jiangli Luo. The patent information provided identifies their professional connection but does not specify further details about their collaboration.

Conclusion

Yingda Liu’s patent focuses on reducing communication-device energy consumption through carefully timed radio frequency channel shutdowns while preserving data communication across carriers.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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