Hsinchu, Taiwan

Ying-Yang Su

USPTO Granted Patents = 9 

Average Co-Inventor Count = 4.2

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 2020-2025

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9 patents (USPTO):Explore Patents

Title: Innovations by Ying-Yang Su: Pioneering Die Bonding Technologies

Introduction

Ying-Yang Su is a distinguished inventor based in Hsinchu, Taiwan, known for his significant contributions to semiconductor technology. With a total of eight patents to his name, Su has made remarkable strides in the field of die bonding, focusing on enhancing the reliability and efficiency of electronic components.

Latest Patents

Among his latest inventions is a method and structure for die bonding using an energy beam. This innovative approach discloses a die-bonding method that employs a target substrate featuring a circuit structure with multiple electrical contacts. It incorporates multiple semiconductor elements, each equipped with a pair of electrodes. The method aligns the semiconductor elements on the substrate with their electrodes corresponding to the electrical contacts. By applying at least one energy beam, the invention facilitates the joining and electrical connection of the electrodes to the contacts in a controlled heating cycle. This technique effectively delivers scattered heated dots across the substrate, mitigating warpage in printed circuit boards (PCBs) and ensuring a robust bonding strength between the semiconductor elements and the substrate’s circuit structure.

Career Highlights

Ying-Yang Su has played a crucial role in driving innovation at Epistar Corporation, a leading firm in the semiconductor industry. His groundbreaking patents have paved the way for advancements in die bonding methods, impacting the design and functionality of electronic devices.

Collaborations

Throughout his career, Su has collaborated with talented colleagues, including Min-Hsun Hsieh and Hsin-Mao Liu. Their teamwork has contributed to the successful development and refinement of new technologies that enhance the efficiency and effectiveness of semiconductor manufacturing processes.

Conclusion

In conclusion, Ying-Yang Su stands out as a notable inventor whose work in die bonding technologies is reshaping the landscape of semiconductor applications. His innovative methods not only improve the structural integrity of electronic components but also enhance overall performance, underscoring the vital role of inventors in advancing technological frontiers. Through his patents and collaborations, Su continues to inspire future innovations in the field.

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