Taoyuan, Taiwan

Ying-Ti Chu


Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 10(Granted Patents)


Company Filing History:


Years Active: 2009

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1 patent (USPTO):Explore Patents

Title: Innovations of Ying-Ti Chu in Polymer Thick-Film Resistors

Introduction

Ying-Ti Chu is a notable inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of polymer thick-film resistors, showcasing his expertise through innovative patent applications. His work focuses on improving the manufacturing processes and tolerances of these essential electronic components.

Latest Patents

Ying-Ti Chu holds a patent titled "Method of applying a polymer thick-film resistive paste for making polymer thick-film resistor having improved tolerances." This invention presents formulations, apparatus, and a method for applying high thixotropic index polymer thick-film resistive pastes. The method involves using a squeegee with a blade tilted at an angle of 10° to 85° to the surface of the printed circuit board. This design creates a fluid rotational motion within the bead of the polymer thick-film resistive paste, enhancing the filling of the resistor-shaped cavity while minimizing air bubbles and surface fractures. Ying-Ti Chu's patent is a testament to his innovative approach, and he has 1 patent to his name.

Career Highlights

Ying-Ti Chu is associated with Embed Technology Co., Ltd., where he applies his knowledge and skills to advance the company's technological capabilities. His work has been instrumental in developing high-quality electronic components that meet industry standards.

Collaborations

Ying-Ti Chu has collaborated with talented individuals such as Te-Yeu Su and Hsin-Herng Wang. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Ying-Ti Chu's contributions to the field of polymer thick-film resistors highlight his innovative spirit and dedication to advancing technology. His patent reflects a significant step forward in manufacturing processes, ensuring improved performance and reliability in electronic components.

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