The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 18, 2009

Filed:

Aug. 07, 2004
Applicants:

Te-yeu Su, Taoyuan, TW;

Hsin-herng Wang, Hsinchu, TW;

Ying-ti Chu, Taoyuan, TW;

Chin-ming Chu, Taipei, TW;

Li-chung Ping, Taipei, TW;

Inventors:

Te-Yeu Su, Taoyuan, TW;

Hsin-Herng Wang, Hsinchu, TW;

Ying-Ti Chu, Taoyuan, TW;

Chin-Ming Chu, Taipei, TW;

Li-Chung Ping, Taipei, TW;

Assignee:

Embed Technology Co., Ltd., Lujhu Township, Taoyuan County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D 5/12 (2006.01); B05D 3/12 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention teaches formulations, apparatus and a method of applying high thixotropic index polymer thick-film resistive pastes for making polymer thick-film resistors with improved tolerances by providing a squeegee with a blade tilted at an angle of 10° to 85° to the surface of the printed circuit board thus causing a fluid rotational motion within the bead of the polymer thick-film resistive paste as the squeegee blade moves relative to the printed circuit board. This rotational motion increases the shear strain rate experienced by the paste within the bead and results in a more effective filling of the resistor-shaped cavity without including air bubbles, experiencing elastic recovery of the paste and, without surface fractures of the paste.


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