Company Filing History:
Years Active: 2011
Title: Innovations of Ying-Lin Chen
Introduction
Ying-Lin Chen is a notable inventor based in Taipei Hsien, Taiwan. He has made significant contributions to the field of electronics, particularly in the development of flexible printed circuit boards and camera modules. With a total of 2 patents, his work showcases innovative approaches to modern technology.
Latest Patents
One of his latest patents is a method of making a flexible printed circuit board. This exemplary method includes forming a substrate comprising metal foil layers interleaved with intervening layers. The process involves laminating intervening layers with metal foil layers, adhering a covering film to the outermost surfaces of the substrate, defining a hole in one side of the substrate through the covering film and at least two metal foil layers, and plating a portion of an inner wall of the hole with conductive material to form a via for electrical connections.
Another significant patent is for a camera module that includes a lens module, an image sensor, and a circuit board. The image sensor module is disposed on the image side of the lens module, and the circuit board is electronically connected with the image sensor module. The design features a receiving chamber that houses the image sensor module, allowing for a reduced thickness and volume compared to conventional camera modules.
Career Highlights
Ying-Lin Chen is currently employed at Hon Hai Precision Industry Co., Ltd., a leading company in the electronics manufacturing sector. His work at this company has allowed him to push the boundaries of technology and contribute to innovative solutions in the industry.
Collaborations
Some of his coworkers include Yung-Chou Chen and Wen-Chang Chen, who have likely collaborated with him on various projects and innovations.
Conclusion
Ying-Lin Chen's contributions to the field of electronics through his patents and work at Hon Hai Precision Industry Co., Ltd. highlight his role as an influential inventor. His innovative methods in flexible printed circuit boards and camera modules continue to impact the technology landscape.