Singapore, Singapore

Ying Kit Chew

This inventor holds 1 USPTO granted patent. Top assignee: National University of Singapore. Active years: 2003.


% Patents Active = 100.0

Average Co-Inventor Count = 11.0

ph-index = 1


Company Filing History:


Years Active: 2003

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1 patent (USPTO):Explore Patents

Title: Innovations by Ying Kit Chew in Optical Stereolithography

Introduction

Ying Kit Chew is an accomplished inventor based in Singapore, known for his contributions to the field of optical stereolithography. His innovative approach has led to advancements in rapid prototyping technologies, particularly in the area of resin curing processes.

Latest Patents

Ying Kit Chew holds a patent titled "Method for determining resin curing areas in an optical stereolithography process." This patent describes a method for determining the areas of resin to be cured in an optical stereolithography process. The method involves generating a computer model of the desired shape and dividing it into layers of a specific thickness. It includes steps to select sets of layers and modify 2-D layer data to compensate for oversizing during the curing sequence. This innovative approach enhances the accuracy and efficiency of the stereolithography process.

Career Highlights

Ying Kit Chew is affiliated with the National University of Singapore, where he contributes to research and development in the field of optical technologies. His work has significantly impacted the way resin curing is approached in rapid prototyping, showcasing his expertise and dedication to innovation.

Collaborations

Ying Kit Chew has collaborated with notable colleagues, including Yoke San Wong and Han Tong Loh. These partnerships have fostered a collaborative environment that encourages the exchange of ideas and advancements in their respective fields.

Conclusion

Ying Kit Chew's contributions to optical stereolithography and resin curing methods exemplify the spirit of innovation in modern technology. His work continues to influence the field and pave the way for future advancements in rapid prototyping.

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