Ying-Hung Ku

Title: Innovations by Ying-Hung Ku

Introduction

Ying-Hung Ku is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of electronic device housings, showcasing his expertise through his innovative patent.

Latest Patents

Ying-Hung Ku holds a patent for "Electronic device housings with patterned electrolytic plating layers." This invention involves an electronic device housing that includes a substrate, an insulating adhesive layer formed on a surface of the substrate, a patterned electroless plating layer formed on the insulating adhesive layer, and a patterned electrolytic plating layer formed on the patterned electroless plating layer. This innovation enhances the functionality and aesthetics of electronic devices.

Career Highlights

Ying-Hung Ku is currently associated with Hewlett-Packard Development Company, L.P. His work at this esteemed organization has allowed him to further develop his skills and contribute to cutting-edge technology in the electronics industry.

Collaborations

Ying-Hung Ku has collaborated with talented individuals such as Yi-Chen Chen and Kun Cheng Tsai. These partnerships have fostered a creative environment that encourages innovation and the development of new technologies.

Conclusion

Ying-Hung Ku's contributions to electronic device housings exemplify the spirit of innovation. His patent reflects a commitment to advancing technology in the electronics sector.