The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 20, 2024
Filed:
Aug. 08, 2019
Applicant:
Hewlett-packard Development Company, L.p., Spring, TX (US);
Inventors:
Yi-Chen Chen, Taipei, TW;
Kun Cheng Tsai, Taipei, TW;
Kuan-Ting Wu, Taipei, TW;
Ying-Hung Ku, Taipei, TW;
Hsueh Chen Hung, Taipei, TW;
Assignee:
Hewlett-Packard Development Company, L.P., Spring, TX (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/18 (2006.01); H05K 1/09 (2006.01); H05K 1/11 (2006.01); H05K 3/02 (2006.01); H05K 3/40 (2006.01); H05K 5/00 (2006.01);
U.S. Cl.
CPC ...
H05K 3/181 (2013.01); H05K 1/09 (2013.01); H05K 1/117 (2013.01); H05K 3/027 (2013.01); H05K 3/188 (2013.01); H05K 3/403 (2013.01); H05K 5/0026 (2013.01); H05K 2203/0502 (2013.01);
Abstract
In one example, an electronic device housing may include a substrate, an insulating adhesive layer formed on a surface of the substrate, a patterned electroless plating layer formed on the insulating adhesive layer, and a patterned electrolytic plating layer formed on the patterned electroless plating layer.
Quick Actions:
Chen, Yi-Chen. (2024). Electronic device housings with patterned electrolytic plating layers (U.S. Patent No. 11910538). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11910538
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile