Chengdu, China

Ying Hu

This inventor holds 1 USPTO granted patent. Top assignee: Chengdu University of Technology. Active years: 2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ying Hu. Retrieved from https://idiyas.com/inventor/ying-hu-255hejon

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 7.0

ph-index = 1


Company Filing History:


Years Active: 2022

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1 patent (USPTO):Explore Patents

Title: Innovations of Ying Hu in Seismic Data Processing

Introduction

Ying Hu is a notable inventor based in Chengdu, China. He has made significant contributions to the field of seismic data processing. His innovative approach has led to the development of a high-resolution processing method that enhances the quality of seismic signals.

Latest Patents

Ying Hu holds 1 patent for his invention titled "High-resolution processing method for seismic data based on inverse multi-resolution singular value decomposition." This patent outlines a method that includes several steps: first, obtaining a single-trace seismic signal as a raw signal; second, decomposing the seismic signal using the MRSVD algorithm to derive detailed singular values; and third, superimposing the new detailed signal on the raw signal to enhance the high-frequency components, resulting in a high-resolution seismic signal.

Career Highlights

Ying Hu is affiliated with Chengdu University of Technology, where he continues to advance his research in seismic data processing. His work is recognized for its practical applications in geophysical exploration and data analysis.

Collaborations

Ying Hu collaborates with colleagues such as Hui Chen and Lingqi Lu, contributing to a dynamic research environment focused on innovative solutions in seismic data processing.

Conclusion

Ying Hu's contributions to seismic data processing exemplify the impact of innovative thinking in scientific research. His patented method represents a significant advancement in the field, showcasing the importance of high-resolution data analysis.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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