Ying-Hao Wei

Title: Innovations by Ying-Hao Wei in Semiconductor Technology

Introduction

Ying-Hao Wei is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the area of electromagnetic interference (EMI) shielding.

Latest Patents

Ying-Hao Wei holds a patent for a semiconductor package shielding structure. This innovative design features a selective EMI shielding structure for a semiconductor package and outlines a method of fabrication. The semiconductor package includes a substrate with a first face, at least one first electronic component mounted adjacent to a first region of the first face, and at least one second electronic component mounted adjacent to a second region of the first face. An encapsulant is disposed over the first and second electronic components, covering the first electronic component directly and the second electronic component through a layer of conductive material.

Career Highlights

Ying-Hao Wei is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to develop cutting-edge technologies in semiconductor packaging. His work has been instrumental in enhancing the performance and reliability of electronic devices.

Collaborations

Ying-Hao Wei collaborates with talented professionals in his field, including Meng-Jen Wang and Chien-Yuan Tseng. Their combined expertise contributes to the advancement of semiconductor technologies.

Conclusion

Ying-Hao Wei's innovative work in semiconductor packaging and EMI shielding demonstrates his commitment to advancing technology in the electronics industry. His contributions are vital for the development of more efficient and reliable electronic devices.