Ying-Bo Yang

Title: Ying-Bo Yang: Innovator in Electronic Device Housing

Introduction

Ying-Bo Yang is a prominent inventor based in Shenzhen, China. He has made significant contributions to the field of electronic device housing, holding a total of 4 patents. His innovative approaches have led to advancements in the design and manufacturing of electronic devices.

Latest Patents

Ying-Bo Yang's latest patents include a method for creating a housing for electronic devices. This method involves providing a ceramic body and forming a pattern layer on its surface to create an embedding member. The pattern layer is made of thermo-sensitive ink material, which enhances the functionality of the housing. Another notable patent is for an electronic device that features a housing and a base plate. This design incorporates a frame made of both metallic and plastic members, which work together to form a robust structure. The base plate is equipped with connecting tabs that are securely attached to the inner surface of the frame.

Career Highlights

Throughout his career, Ying-Bo Yang has worked with notable companies such as Shenzhen Futaihong Precision Industry Co., Ltd. and Fih (Hong Kong) Limited. His experience in these organizations has allowed him to refine his skills and contribute to various innovative projects.

Collaborations

Ying-Bo Yang has collaborated with talented individuals in his field, including Yu-Tsai Wang and Bi-Ling Dong. These partnerships have fostered a creative environment that encourages the development of groundbreaking technologies.

Conclusion

Ying-Bo Yang's contributions to the field of electronic device housing demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of materials and design, positioning him as a key figure in the industry.