Beijing, China

Yinchuang Yang

This inventor holds 1 USPTO granted patent and 3 published patent applications. Top assignee: Bitmain Technologies Limited. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yinchuang Yang. Retrieved from https://idiyas.com/inventor/yinchuang-yang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Yinchuang Yang and Fluid Immersion Cooling

Introduction

Yinchuang Yang is an inventor based in Beijing, China, associated with Bitmain Technologies Limited. His patent work includes a fluid immersion cooling system designed to guide cooling liquid through equipment containing multiple circuit boards.

Latest Patents

Yang is credited with 1 patent. His patent, “Fluid Immersion Cooling System,” describes a housing containing multiple circuit boards positioned apart from one another near the housing’s bottom. Guide holes are provided on the sides of the boards facing the bottom, while partitions sit between adjacent boards with space between each partition and the corresponding boards. Together, these spaces, the areas above the partitions, and the guide holes form a continuously bent channel for cooling liquid to flow through.

Career Highlights

Yang’s listed invention focuses on the design of a liquid-cooling flow path for circuit boards. The patent describes how the arrangement of boards, partitions, and guide holes directs coolant through the housing.

Collaborations

Yang’s listed coworkers include Minghao Li and Zhaoxiang Zeng. The available information identifies Bitmain Technologies Limited as his company but does not specify the coworkers’ roles in the patent.

Conclusion

Yinchuang Yang’s patent presents a structured approach to fluid immersion cooling, using a continuously bent flow channel to direct coolant around circuit boards.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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