This inventor holds 1 USPTO granted patent and 3 published patent applications. Top assignee: Mediatek Corporation. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Yin-Fa Chen: Innovator in Semiconductor Packaging
Introduction
Yin-Fa Chen is a prominent inventor based in Hsinchu, Taiwan. She has made significant contributions to the field of semiconductor technology. Her innovative work has led to the development of a unique semiconductor package structure.
Latest Patents
Yin-Fa Chen holds 1 patent for her invention titled "Semiconductor package structure." This patent describes a semiconductor package that includes a first redistribution layer, a second redistribution layer, a first semiconductor die, a second semiconductor die, an adhesive layer, and a molding material. The design allows for the first and second semiconductor dies to be stacked vertically, enhancing the efficiency and performance of semiconductor devices.
Career Highlights
Yin-Fa Chen is currently employed at MediaTek Corporation, a leading global semiconductor company. Her role at MediaTek has allowed her to further her research and development efforts in semiconductor packaging. Her work is instrumental in advancing the technology used in various electronic devices.
Conclusion
Yin-Fa Chen is a trailblazer in the semiconductor industry, with her innovative patent contributing to the advancement of technology. Her dedication to her work at MediaTek Corporation showcases her commitment to innovation in the field.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile