This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: Zte Corporation. Active years: 2026.
Company Filing History:
Years Active: 2026
Title: Yichuo Shi: Innovator in Thermoforming Technology
Introduction
Yichuo Shi is a prominent inventor based in Shenzhen, China. He has made significant contributions to the field of flexible printed circuit boards through his innovative designs and methods. His work has garnered attention for its practical applications in modern technology.
Latest Patents
Yichuo Shi holds a patent for a "Thermoforming device and method for flexible circuit board." This invention discloses a thermoforming device that includes a first forming mechanism with a first forming portion designed to carry the flexible printed circuit board for processing. The device also features a second forming mechanism with a matching second forming portion, where at least one of the portions is equipped with a heating module for heat treatment. The invention includes driving mechanisms that allow the two forming mechanisms to be displaced relative to each other, enhancing the efficiency of the thermoforming process.
Career Highlights
Yichuo Shi is currently employed at ZTE Corporation, a leading telecommunications and information technology company. His role at ZTE has allowed him to further develop his expertise in circuit board technology and contribute to the company's innovative projects.
Collaborations
Yichuo Shi has collaborated with notable colleagues, including Yiming Li and Da Chen. These partnerships have fostered a creative environment that encourages the exchange of ideas and advancements in technology.
Conclusion
Yichuo Shi's contributions to the field of thermoforming technology for flexible printed circuit boards highlight his innovative spirit and dedication to advancing electronic manufacturing processes. His work continues to influence the industry and pave the way for future developments.