Company Filing History:
Years Active: 2025
Title: Yi-Wen Chiang: Innovator in QFN Package Design
Introduction
Yi-Wen Chiang is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of electronics, particularly in the design of board-level pad patterns for multi-row QFN (Quad Flat No-lead) packages. His innovative approach has led to the development of a unique patent that enhances the efficiency of electronic component mounting.
Latest Patents
Yi-Wen Chiang holds a patent titled "Board-level pad pattern for multi-row QFN packages." This patent describes a board-level pad pattern that includes staggered ball pads disposed within a surface mount region for mounting a multi-row QFN package. The staggered ball pads consist of first ball pads arranged in a first row and second ball pads arranged in a second row. Notably, the first ball pads in the first row are arranged at two different pitches, while the second ball pads in the second row are arranged at a constant pitch. This innovative design improves the reliability and performance of electronic devices.
Career Highlights
Yi-Wen Chiang is currently employed at MediaTek Corporation, a leading global semiconductor company. His work at MediaTek has allowed him to apply his expertise in electronic design and contribute to the advancement of technology in the industry. His patent reflects his commitment to innovation and excellence in his field.
Collaborations
Throughout his career, Yi-Wen has collaborated with talented colleagues, including Hui-Chi Tang and Hsuan-Yi Lin. These collaborations have fostered a creative environment that encourages the exchange of ideas and the development of cutting-edge technologies.
Conclusion
Yi-Wen Chiang is a distinguished inventor whose work in QFN package design has made a significant impact on the electronics industry. His innovative patent and contributions at MediaTek Corporation highlight his dedication to advancing technology. His collaborations with fellow inventors further enhance the potential for future innovations in the field.