The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 26, 2025
Filed:
Dec. 06, 2022
Applicant:
Mediatek Inc., Hsin-Chu, TW;
Inventors:
Hui-Chi Tang, Hsinchu, TW;
Hsuan-Yi Lin, Hsinchu, TW;
Shao-Chun Ho, Hsinchu, TW;
Yi-Wen Chiang, Hsinchu, TW;
Pu-Shan Huang, Hsinchu, TW;
Assignee:
MEDIATEK INC., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H01L 23/498 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49838 (2013.01); H01L 23/49811 (2013.01); H05K 1/111 (2013.01); H05K 1/181 (2013.01); H05K 2201/094 (2013.01);
Abstract
A board-level pad pattern includes staggered ball pads disposed within a surface mount region for mounting a multi-row QFN package. The staggered ball pads include first ball pads arranged in a first row and second ball pads arranged in a second row. The first ball pads in the first row are arranged at two different pitches, and the second ball pads in the second row are arranged at a constant pitch.