Hsuan-Yi Lin

Title: Hsuan-Yi Lin: Innovator in QFN Package Technology

Introduction

Hsuan-Yi Lin is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of electronics, particularly in the design of board-level pad patterns for multi-row QFN (Quad Flat No-lead) packages. With a total of 2 patents to his name, Lin's work is recognized for its innovative approach to enhancing electronic component design.

Latest Patents

Lin's latest patents focus on advanced board-level pad patterns that improve the functionality and efficiency of multi-row QFN packages. The first patent describes a board-level pad pattern that includes staggered ball pads arranged within a surface mount region. This design features first ball pads in a first row arranged at two different pitches, while second ball pads in a second row are arranged at a constant pitch. The second patent also emphasizes a similar board-level pad pattern, incorporating a printed circuit board (PCB) substrate with an exposed pad region. This design includes multiple staggered ball pads arranged in a ring shape around the exposed pad region, enhancing the overall performance of the QFN packages.

Career Highlights

Hsuan-Yi Lin is currently employed at MediaTek Corporation, a leading global semiconductor company. His work at MediaTek has allowed him to collaborate with other talented engineers and inventors, contributing to the advancement of technology in the electronics industry.

Collaborations

Lin has worked alongside notable colleagues such as Hui-Chi Tang and Shao-Chun Ho. Their collaborative efforts have played a crucial role in the development of innovative solutions in the field of electronics.

Conclusion

Hsuan-Yi Lin's contributions to the design of QFN packages demonstrate his commitment to innovation in electronics. His patents reflect a deep understanding of the complexities involved in electronic component design, positioning him as a key figure in the industry.