This inventor holds 2 USPTO granted patents and 5 published patent applications. Top assignee: Benq Materials Corporation. Active years: 2026.
IDiyas Innovation Intelligence. (2026). Inventor Profile: Yi-ting Lo. Retrieved from https://idiyas.com/inventor/yi-ting-lo-bzblt1e6
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
USPTO Granted Patents = 2 (Patent Applications = 5)
Average Co-Inventor Count = 3.0
ph-index = 1
Company Filing History:
Years Active: 2026
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2 patents (USPTO):Explore Patents
Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
5 patents pending:
IDiyas Innovation Intelligence. (2026). Inventor Profile: Yi-ting Lo. Retrieved from https://idiyas.com/inventor/yi-ting-lo-bzblt1e6
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]