Taipei, Taiwan

Yi-Te Wang

This inventor holds 1 USPTO granted patent. Top assignee: Inventec Corp.. Active years: 2007.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yi-Te Wang. Retrieved from https://idiyas.com/inventor/yi-te-wang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 2007

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1 patent (USPTO):Explore Patents

Title: Yi-Te Wang: Innovator in Packaging Inspection Technology

Introduction

Yi-Te Wang is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of packaging inspection and verification systems. His innovative approach addresses critical issues in product packaging, ensuring accuracy and consistency.

Latest Patents

Yi-Te Wang holds a patent for a "Packaging inspection and verification system and method." This invention is designed to enhance the reliability of packaging processes. The system utilizes an identification device to read type barcodes of products and labels affixed to packing boxes. A processing unit then cross-references these barcodes with a database to ensure consistency. If discrepancies are found, the system generates a signal indicating an error in the product accessories or labels.

Career Highlights

Wang is currently employed at Inventec Corporation, where he continues to develop innovative solutions in packaging technology. His work has been instrumental in improving the efficiency and accuracy of packaging processes within the company.

Collaborations

Throughout his career, Yi-Te Wang has collaborated with talented individuals such as Shoui-Liang Wong and Shan-Fa Shih. These partnerships have fostered a creative environment that encourages innovation and problem-solving.

Conclusion

Yi-Te Wang's contributions to packaging inspection technology exemplify the importance of innovation in ensuring product quality. His patent reflects a commitment to enhancing packaging processes, making a significant impact in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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