Company Filing History:
Years Active: 2005-2006
Title: Celebrating the Innovations of Yi-Tang Weng
Introduction: Yi-Tang Weng, an esteemed inventor from Tao-Yuan, Taiwan, has made significant contributions to the field of electronic packaging technology. With a total of two patents to his name, Weng is recognized for his innovative techniques in fabricating packaging substrates, addressing reliability issues faced in the electronics industry.
Latest Patents: Yi-Tang Weng's latest patents focus on methods for fabricating packaging substrates that improve the reliability of electronic components. His first patent describes a unique method for fabricating a packaging substrate that employs two plating steps, specifically designed for plating gold areas on both sides of the substrate. The innovation introduces a solder mask layer that defines the gold-plating areas, ensuring that the plated gold layer does not overlap with the solder mask, thus effectively preventing peeling and enhancing overall reliability.
In his second patent, Weng introduces a method for making a packaging substrate through a multi-layered process involving a thin copper seed layer and resist layers. This method defines a wire layout for copper plating, followed by electroplating of copper and subsequent plating of Ni/Au layers on the wiring. The process not only streamlines production but also improves the precision and quality of the electronic components, showcasing Weng's commitment to advancing the field.
Career Highlights: Yi-Tang Weng is currently employed at Nan Ya Printed Circuit Board Corporation, a leading company in the printed circuit board industry. His role involves research and development aimed at enhancing fabrication techniques and addressing the challenges within electronic packaging. Weng’s innovative ideas and practical solutions have positioned him as a key player in the company.
Collaborations: Throughout his career, Yi-Tang Weng has collaborated with other talented professionals, including Wei-Hsin Lin and Shing-Fun Ho. These partnerships have fostered a creative environment where inventive solutions are developed to meet the evolving needs of the technology sector.
Conclusion: As an inventor, Yi-Tang Weng's contributions to the fabrication of packaging substrates have significantly impacted the electronics industry. His innovative methods reflect a deep understanding of the challenges faced by engineers and manufacturers alike. With ongoing efforts and collaboration, Weng continues to push the boundaries of technology, paving the way for future breakthroughs in electronic packaging.