Hsinchu, Taiwan

Yi-Shan Hsieh

This inventor holds 1 USPTO granted patent and 7 published patent applications. Top assignee: Sino-American Silicon Products Inc.. Active years: 2014.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yi-Shan Hsieh. Retrieved from https://idiyas.com/inventor/yi-shan-hsieh

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 2014

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1 patent (USPTO):Explore Patents

Title: Yi-Shan Hsieh: Innovator in Semiconductor Technology

Introduction

Yi-Shan Hsieh is an inventor based in Hsinchu City, Taiwan. He has made significant contributions to the field of semiconductor technology. His innovative approach focuses on enhancing the efficiency and performance of semiconductor devices.

Latest Patent Applications

Yi-Shan Hsieh has filed a patent application titled "SEMICONDUCTOR DEVICE AND METHODS OF FORMATION." This application describes a semiconductor die that includes top conductive structures of different sizes. The bonding vias are formed only on the larger top conductive structures. This design results in lesser vertical dimensions for the bonding vias, reducing the amount of narrowing that occurs in their width. Consequently, this leads to a greater surface area contact between the bottom of the bonding vias and the underlying top conductive structures. This innovation enables a low contact resistance to be achieved between the bonding vias and the underlying top conductive structures.

Conclusion

Yi-Shan Hsieh's work in semiconductor technology showcases his commitment to innovation and efficiency in device design. His contributions have the potential to impact the semiconductor industry significantly.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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