Yi-Liang Hsiao

Title: The Innovative Mind of Yi-Liang Hsiao

Introduction

Yi-Liang Hsiao is a notable inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of electronic components, particularly in heat dissipation technologies. With a total of 3 patents to his name, Hsiao's work exemplifies innovation and practicality in engineering.

Latest Patents

One of Yi-Liang Hsiao's latest patents is a heat dissipation device designed for dissipating heat from plug-in electronic components, such as memory modules. This device features a base frame, a moving frame, and a retaining cover. The base frame is positioned adjacent to the electronic component, while the moving frame is mounted on the base frame for mobility. A heat dissipation fan is attached to the retaining cover, which is also movably mounted on the moving frame. This design allows the heat dissipation fan to have a retraction position, where it does not obstruct access to the electronic components, and a heat dissipation position, where it effectively dissipates heat. The position of the fan can be adjusted based on actual heat dissipation needs, providing an optimal mode for heat management.

Career Highlights

Throughout his career, Yi-Liang Hsiao has worked with prominent companies in the technology sector. Notably, he has been associated with Micro-Star International Co., Ltd., where he has contributed to various innovative projects. His experience in these companies has allowed him to refine his skills and develop groundbreaking inventions.

Collaborations

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Conclusion

Yi-Liang Hsiao's contributions to heat dissipation technology highlight his innovative spirit and dedication to improving electronic component performance. His patents reflect a deep understanding of engineering principles and a commitment to advancing technology.