Micro-star Int'l Co., Limited.

Micro-star International Co., Ltd.

Yi-Liang Hsiao

A heat dissipation device for dissipating heat from a plug-in electronic component, such as a memory is provided. The heat dissipation device includes a base frame, a moving frame, and a retaining cover. The base frame is disposed at one side of the electronic component. The moving frame is movably mounted on the base frame. A heat dissipation fan is mounted on the retaining cover, and the retaining cover is also movably mounted on the moving frame. In this manner, the heat dissipation fan has at least a retraction position where the heat dissipation fan is not overlaid above the electronic components so as to plug or remove the electronic component, and a heat dissipation position where the heat dissipation fan dissipates heat from the corresponding electronic component. Furthermore, the heat dissipation position changes in accordance with actual heat dissipation requirements, thereby providing an optimal heat dissipation mode.

Heat dissipation device

A supporting frame structure movably joined in a case is used to mount a loaded object, such that the object can be disposed in the case or moved outside the case. In the present invention, a motion mechanism is disposed between the case and the supporting frame, by which the supporting frame has a handling position outside the case and a fixed position inside the case. At the fixed position, the motion mechanism forms an interference relation, such that the supporting frame is fixed on the mounting position and is unable to be departed from the case.

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Taoyuan, Taiwan

Yi-Liang Hsiao