This inventor holds 1 USPTO granted patent. Top assignee: Super Micro Computer, Inc.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Yi-Kuan Liao: Inventor of a Thermal Interface Material Protection Design
Introduction
Yi-Kuan Liao is an inventor associated with Taoyuan, Taiwan. His patent work addresses the placement and protection of thermal interface material in electronic assemblies.
Latest Patents
Liao is credited with 1 patent: “Confinement and Protection of a Thermal Interface Material Between a Heat Sink and an Electronic Device.” The invention describes an electronic assembly with a groove cut into a heat sink’s surface. Thermal interface material sits between the heat sink and an electronic device, while compressible filler in the groove surrounds and confines the material.
Career Highlights
The provided information associates Liao with Super Micro Computer, Inc. His patent focuses on a design intended to keep thermal interface material confined between heat-transfer components.
Collaborations
Liao’s listed coworker is Kuan-Lin Peng. Their association is provided in connection with the supplied inventor and patent information.
Conclusion
Yi-Kuan Liao’s patent describes a practical approach to confining thermal interface material in an electronic assembly, reflecting his contribution to thermal management design.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile