Yi-Jun Lu

Title: Yi-Jun Lu: Innovator in Through-Silicon Via Technology

Introduction

Yi-Jun Lu is a prominent inventor based in Hefei, China. He has made significant contributions to the field of integrated circuits, particularly in the area of through-silicon via (TSV) technology. His innovative work has led to the development of advanced detecting circuits that enhance the functionality and reliability of integrated circuits.

Latest Patents

Yi-Jun Lu holds a patent for a "Through-silicon via detecting circuit, detecting methods and integrated circuit thereof." This patent discloses a TSV detecting circuit that includes a first detecting module and a second detecting module. The first detecting module comprises a first comparison unit, a first input unit, and a first switching unit, which work together to transmit input signals and detect signals from the TSV. The second detecting module similarly includes a second input unit and a second switching unit, allowing for comprehensive detection capabilities. This innovation is crucial for improving the performance of integrated circuits.

Career Highlights

Yi-Jun Lu is currently employed at Changxin Memory Technologies, Inc., where he continues to push the boundaries of technology in memory solutions. His expertise in TSV technology has positioned him as a key player in the advancement of integrated circuit design and manufacturing.

Collaborations

Throughout his career, Yi-Jun Lu has collaborated with notable colleagues, including You-Hsien Lin and Cheng-Jer Yang. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.

Conclusion

Yi-Jun Lu's contributions to through-silicon via technology exemplify his commitment to advancing integrated circuit design. His patent and ongoing work at Changxin Memory Technologies, Inc. highlight his role as a leading inventor in the field.