Taichung, Taiwan

Yi-Ju Lee

This inventor holds 1 USPTO granted patent. Top assignee: Other. Active years: 2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yi-Ju Lee. Retrieved from https://idiyas.com/inventor/yi-ju-lee-7jos59hc

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:

goldMedal1 out of 834,601 
Other
 patents

Years Active: 2021

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1 patent (USPTO):Explore Patents

Title: Yi-Ju Lee: Innovator in Signal Connector Technology

Introduction

Yi-Ju Lee is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of signal connector technology. His innovative approach has led to the development of a unique patent that enhances the stability and efficiency of signal connections.

Latest Patents

Yi-Ju Lee holds a patent for a "Combination structure of clamping member and circuit board for signal connector." This invention features a combination structure that includes two clamping members fixedly connected to either side of a circuit board. Each clamping member is equipped with a pair of first positioning pins and a pair of second positioning pins. This design ensures that the center of the guide pin is properly guided and prevents loosening, thereby improving signal stability and reducing loss.

Career Highlights

Throughout his career, Yi-Ju Lee has focused on innovations that address common challenges in electronic connectivity. His work has been instrumental in advancing the reliability of signal connectors, which are crucial in various electronic applications.

Collaborations

Yi-Ju Lee collaborates with Chun-Te Lee, who is also involved in the field of signal technology. Their partnership exemplifies the importance of teamwork in driving innovation and achieving successful outcomes in their projects.

Conclusion

Yi-Ju Lee's contributions to signal connector technology demonstrate his commitment to innovation and excellence. His patent reflects a significant advancement in the field, showcasing his ability to solve complex engineering challenges.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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