Yi-Hui Hsiao

Title: Yi-Hui Hsiao: Innovator in Diaphragm Assembly and Vibration Module Technologies

Introduction

Yi-Hui Hsiao is an inventor based in Taipei City, Taiwan. He has made significant contributions to the field of diaphragm assembly and vibration module technologies. Although he currently holds no granted patents, his innovative ideas are reflected in his latest patent applications.

Latest Patent Applications

1. **Diaphragm Assembly, Method of Manufacturing Diaphragm Assembly and Injection Mold**: This invention provides a diaphragm assembly along with a method for its manufacturing and an injection mold. The method includes providing a cone with at least one alignment feature at its peripheral edge, along with a mounting tool that comprises at least one cooperating fixing element. The alignment feature is aligned with the fixing element, and a surround is formed at the peripheral edge of the cone.

2. **Vibration Module, Speaker Having the Same, and Manufacturing Method Thereof**: This application discloses a vibration module, a speaker that incorporates this module, and a manufacturing method. The vibration module consists of a surround and a diaphragm. The surround features an annular convex section, a first annular portion, and a second annular portion. The annular convex section connects to the diaphragm to provide a damping effect, while the first annular portion has a protrusion opposite to the convex section. The second annular portion serves as the rim of the surround.

Conclusion

Yi-Hui Hsiao's innovative work in diaphragm assembly and vibration module technologies showcases his potential as an inventor. His latest patent applications reflect his commitment to advancing these fields.