Livonia, MI, United States of America

Yi-Hsin Pao


Average Co-Inventor Count = 2.5

ph-index = 3

Forward Citations = 84(Granted Patents)


Company Filing History:


Years Active: 1995-1999

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5 patents (USPTO):Explore Patents

Title: The Innovations of Inventor Yi-Hsin Pao

Introduction

Yi-Hsin Pao is a notable inventor based in Livonia, MI (US), who has made significant contributions to the field of solder joint technologies. With a total of five patents to his name, Pao has developed innovative solutions that enhance the reliability and performance of electronic connections.

Latest Patents

One of Yi-Hsin Pao's latest patents focuses on "Optimized solder joints and lifter pads for improving the solder joint." This invention describes a surface mount printed circuit board that includes a substrate and at least one surface mount device, connected by solder joints to mounting pads. The design incorporates lifter pads that ensure the device maintains a specific height above the pads, while the dimensions and configurations of the pads contribute to optimal solder joint performance. The invention aims to maintain solder joint integrity by delaying crack initiation times and increasing the length of crack propagation. Another significant patent is centered on "Standoff controlled interconnection," which outlines a method for joining components to substrates using a dual solder system. This method utilizes a base solder with a higher melting temperature standoff portion, creating robust solder joints that maintain desired clearances.

Career Highlights

Yi-Hsin Pao has had a distinguished career working with prominent organizations, including Ford Global Technologies, LLC and Ford Motor Company Limited. His role in these companies has allowed him to leverage his expertise in solder joint technology, contributing to advancements in automotive electronics and beyond.

Collaborations

Throughout his career, Pao has worked alongside knowledgeable colleagues such as Vivek Amir Jairazbhoy and Richard Keith McMillan. Their collaborative efforts have influenced the development and enhancement of technologies related to solder joints, reflecting their commitment to innovation in the field.

Conclusion

Yi-Hsin Pao's contributions to solder joint technologies demonstrate his innovative spirit and dedication to improving electronic connectivity. His patents not only showcase his technical expertise but also a profound understanding of the industry's needs. As technology continues to evolve, Pao's work will undoubtedly leave a lasting impact on future advancements in this critical area.

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