The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 31, 1995
Filed:
Nov. 12, 1993
Applicant:
Inventor:
Yi-Hsin Pao, Livonia, MI (US);
Assignee:
Ford Motor Company, Dearborn, MI (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
361761 ; 361790 ; 174260 ; 257686 ; 257724 ;
Abstract
A novel printed circuit board is disclosed. The printed circuit board has a high density of circuit components with lower circuit components residing within recesses in a printed wiring board and upper circuit components residing above the lower circuit components.
Quick Actions:
Pao, Yi-Hsin. (1995). Double surface mount technology for electronic packaging (U.S. Patent No. 5386343). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5386343
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile