Shanghai, China

Yi Han

This inventor holds 2 USPTO granted patents and 4 published patent applications. Top assignees: Celanese International Corporation, Paypal, Inc.. Active years: 2016-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yi Han. Retrieved from https://idiyas.com/inventor/yi-han-hu5nov4t

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 2 

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2016-2026

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2 patents (USPTO):Explore Patents

Title: Yi Han - Innovator in Adhesive Technology

Introduction

Yi Han is a notable inventor based in Shanghai, China. He has made significant contributions to the field of adhesive technology, particularly with a focus on bonding wood materials. His innovative approach has led to the development of a unique adhesive composition that is both effective and versatile.

Latest Patents

Yi Han holds a patent for an adhesive composition suitable for bonding wood, especially hardwood. The patent, titled "Adhesive composition and use thereof," discloses a formulation that includes a vinyl acetate-ethylene copolymer-based emulsion, a vinyl alcohol polymer, and a polyisocyanate. This invention not only details the composition but also outlines the process for preparing the adhesive and its various applications.

Career Highlights

Yi Han is currently employed at Celanese International Corporation, where he continues to innovate in the field of adhesive solutions. His work at Celanese has allowed him to collaborate with other experts in the industry, further enhancing the development of advanced adhesive technologies.

Collaborations

Some of Yi Han's coworkers include Xiaodong Zhao and Bangfang He. Their collective expertise contributes to the innovative environment at Celanese International Corporation.

Conclusion

Yi Han's contributions to adhesive technology exemplify the importance of innovation in material science. His patent for an adhesive composition demonstrates his commitment to advancing the industry and providing effective solutions for bonding applications.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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