Taipei, Taiwan

Yi-Feng Huang

This inventor holds 26 USPTO granted patents and 4 published patent applications, primarily in Antenna Technology. Top assignees: Cheng Uei Precision Industry Co., Ltd., Giant Glory International Limited, Syneurx International (Taiwan) Corp.. Active years: 2011-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yi-Feng Huang. Retrieved from https://idiyas.com/inventor/yi-feng-huang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 26 

% Patents Active = 80.8

Average Co-Inventor Count = 3.1

ph-index = 9

Forward Citations = 870(Granted Patents)


Location History:

  • Tu-Cheng, TW (2011)
  • Taipei, TW (2011)
  • New Taipei, TW (2011 - 2015)

Company Filing History:


Years Active: 2011-2026

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Areas of Expertise:
Multi-Band Antenna
Composite Structure
Three Dimensional Stacked Structure
Printed Antenna
Antenna Design
Chip Design
Manufacturing Methods
Structural Engineering
Wireless Communication
RF Technology
Telecommunication
3D Stacking
26 patents (USPTO):Explore Patents

Title: Innovations of Yi-Feng Huang: A Journey Through Patents and Collaborations

Introduction: Yi-Feng Huang, based in New Taipei, Taiwan, is a prominent inventor with an impressive portfolio of 23 patents. His contributions to the field of technology, especially in composite structures and three-dimensional (3D) chip architectures, reflect his innovative spirit and technical expertise.

Latest Patents: Two of his latest patents showcase his groundbreaking work. The first patent, titled "Method for Manufacturing a Composite Structure," describes a detailed process for creating a composite structure with first and second structural members. This method involves placing a plate in a forming mold, manipulating the mold to deform the plate, injecting molten substrate, and subsequently forming and removing the structural members.

The second patent, "Three-Dimensional Stacked Structure for Chips," reveals a novel 3D chip stacked structure. This invention allows for advanced connectivity between chip layers via vertically communicating through silicon vias (TSVs). The strategic arrangement of conductive members enhances signal integrity and promotes more efficient data transfer between chip layers.

Career Highlights: Yi-Feng Huang has made significant strides throughout his career, notably through his tenure at Cheng Uei Precision Industry Co., Ltd. His expertise and innovative approach have cemented his reputation as a key figure in the technology sector.

Collaborations: Throughout his career, Huang has worked alongside skilled professionals such as Kai Shih and Jia-Hung Su. Their collaborative efforts have likely contributed to the successful development of his numerous patents and advancements in technology.

Conclusion: Yi-Feng Huang's achievements in patenting innovative methods for composite structures and advanced chip architectures position him as an influential inventor within the technology landscape. His ongoing work continues to inspire advancements in material science and electronic design, reflecting the importance of innovation in driving technological progress.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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