Cheng Uei Precision Industry Co., Ltd.

Giant Glory International Limited

Other

Yi-Feng Huang

Kai Shih

Jia-Hung Su

Ching-feng Tseng

Lan-yung Hsiao

Shih-Yuan Mi

Feng-Ming Hsu

Cheng-Ping Hsiao

Yung-Chih Tsai

Tsai-Yu Huang

Huei-Chuen Tseng

A method for producing an outer shell includes steps of a) stacking a second plate on a first plate, the second plate having an accommodation space that is recessed toward the first plate; b) disposing a filling material in the accommodation space; c) stacking a third plate on the second plate so as to cover the filling material and to form a composite structure; and d) stamping the composite structure such that a peripheral portion of the composite structure is bent, thereby forming an outer shell. In step b), a weight of the filling material is lower than that of the first plate, that of the second plate, and that of the third plate, or rigidity of the filling material is higher than that of the first plate, that of the second plate, and that of the third plate.

Method for producing outer shell

A method for manufacturing a composite structure having first and second structural members includes the steps of: (A) placing a plate in a forming mold having a first molding member, and a second molding member with an injection hole; (B) moving the first molding member toward the second molding member to stamp and deform the plate; (C) injecting a molten substrate onto the plate via the injection hole to stamp and deform again the plate so as to form the first structural member; (D) removing an assembly of the first structural member and a solidified substrate from the first molding member; and (E) removing an excess part of the solidified substrate to form the second structural member.

Method for manufacturing a composite structure

A 3-D chip stacked structure is disclosed. Each chip layer is provided with plural single-layered conductive members where among the same chip layer the two adjacent conductive members are structurally formed in mirror symmetric way with each other along a chip longitudinal direction and the arrangements of the single-layered conductive members of the two adjacent chip layers are shifted by a test pad distance. The single-layered conductive members of the two adjacent chip layers are communicated through a vertical TSV (through silicon via). Therefore, a selection signal or an enabling signal might be transferred through this specific metal layer and related TSV to reach targeting chip layer and targeting circuit.

Three dimensional stacked structure for chips

A multi-band antenna includes a substrate and a conductive layer. The conductive layer covered on a top surface of the substrate includes a ground element, a first radiating element and a second radiating element. The ground element is connected with a bottom side edge of the substrate. The first radiating element is connected with one end of a lower top edge of the ground element. The first radiating element includes a connection portion, a first coupling portion, a first radiating portion and a first inductance portion. The second radiating element is connected with the other end of the lower top edge of the ground element. The second radiating element includes a second inductance portion, a second coupling portion, a second radiating portion and a third radiating portion.

Multi-band antenna

A multi-band antenna includes a base plate of which a feeding portion, a connection section and a ground portion are connected with rear, front and left edges of the base plate respectively, a first radiating element connected with a right edge of the base plate and coplanar with the base plate, a second radiating element coplanar with the base plate and the connection section and connected with an upper portion of a left rim of the connection section with a free end thereof adjacent to the ground portion, and a third radiating element connected with a lower end of the left rim of the connection section. Wherein the second radiating element is apart located between the ground portion and the third radiating element.

A multi-band antenna includes a base portion, a substantially lying U-shaped first radiating portion, a substantially lying L-shaped second radiating portion and a third radiating portion. A rear edge of the base portion extends rearward to form a ground portion with a ground point being defined thereon. A top of the base portion defines a feeding point. The first radiating portion of which one end is connected with a first side edge of the base portion and the mouth faces to the first side edge of the base portion. The second radiating portion is connected with a second side edge of the base portion. The third radiating portion tortuously extends downward from a front edge of the base portion, then extends transversely, and further circuitously extends rearward to be located substantially near under a free arm of the second radiating portion.

Provided is a multiband printed antenna for receiving and emitting multiple electromagnetic wave signals of different bands. The multiband printed antenna includes a substrate and a conductive layer formed on a positive surface of the substrate. The conductive layer includes a grounding portion, a plurality of radiating portions controlling different bands and a single feeder point used to transmit electromagnetic wave signals. The multiband printed antenna of the present invention can separately control multiple radiating portions, which have different bands and are together formed on one same substrate, to emit the electromagnetic wave signals at one same feeder point, thereby realizing the object of the single printed antenna controlling multiple bands and greatly reducing the manufacture cost to satisfy the demand of 4G communication industry.

Growing community of inventors

Taipei, Taiwan

Yi-Feng Huang