Yi-Chih Chang

Title: Yi-Chih Chang: Innovator in Wafer Bonding Technologies

Introduction

Yi-Chih Chang is a prominent inventor based in Hsin-Chu, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in wafer bonding methods. With a total of 2 patents to his name, Chang's work has been instrumental in advancing the performance of semiconductor substrates.

Latest Patents

Chang's latest patents focus on methods for improving wafer bonding performance. These patents disclose innovative techniques for bonding a pair of semiconductor substrates. The methods include processing at least one of the substrates and bonding them together. Each substrate undergoes processes such as chemical vapor deposition (CVD) and chemical mechanical polishing (CMP). Notably, one of the CVD processes is performed after all CMP has been completed before bonding.

Career Highlights

Yi-Chih Chang is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His expertise in wafer bonding has positioned him as a key player in the development of advanced semiconductor technologies.

Collaborations

Chang has collaborated with notable colleagues, including Chien-Wei Chang and Ya-Jen Sheuh. These partnerships have fostered innovation and contributed to the success of their projects in the semiconductor field.

Conclusion

Yi-Chih Chang's contributions to wafer bonding technologies exemplify his commitment to innovation in the semiconductor industry. His patents and collaborative efforts continue to influence advancements in this critical area of technology.