Xindian, Taiwan

Yi-Cheng Kuo

This inventor holds 1 USPTO granted patent. Top assignee: Via Technologies, Inc.. Active years: 2008.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yi-Cheng Kuo. Retrieved from https://idiyas.com/inventor/yi-cheng-kuo-ja4is1h8

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 5(Granted Patents)


Company Filing History:


Years Active: 2008

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1 patent (USPTO):Explore Patents

Title: Yi-Cheng Kuo: Innovator in Thermal Management Solutions

Introduction

Yi-Cheng Kuo is a notable inventor based in Xindian, Taiwan. He has made significant contributions to the field of thermal management through his innovative designs. His work focuses on creating solutions that enhance efficiency and performance in various applications.

Latest Patents

Yi-Cheng Kuo holds a patent for a "Fixed Pillar with Heat Loss." This invention is designed to facilitate the rapid loss of thermal energy. The fixed pillar comprises a metal body, a screw thread, and multiple grooves. The hollow metal body allows air to flow in from one side, pass through its interior, and exit from the opposite side. This design enables effective heat exchange with the air, promoting quick thermal energy loss.

Career Highlights

Kuo is currently employed at Via Technologies, Inc., where he continues to develop innovative solutions. His work at the company has positioned him as a key player in advancing thermal management technologies.

Collaborations

He collaborates with talented coworkers, including Chi-Chang Chang and Cheng-Ming Hsu, to drive innovation within the company.

Conclusion

Yi-Cheng Kuo's contributions to thermal management through his patented inventions highlight his role as an influential inventor in the industry. His work continues to impact the efficiency of thermal systems, showcasing the importance of innovation in technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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