Company Filing History:
Years Active: 2009-2018
Title: Yi Bin Wang: Innovator in Wire Bonding Technology
Introduction
Yi Bin Wang is a prominent inventor based in Singapore, known for his contributions to wire bonding technology. He holds a total of 5 patents, showcasing his expertise and innovative spirit in the field.
Latest Patents
One of his latest patents is titled "Method and apparatus for measuring a free air ball size during wire bonding." This invention discloses a method for measuring the size of a free air ball during the wire bonding process. It involves a position sensor and a bonding tool that forms an electrical connection between a semiconductor device and a substrate using a bonding wire. The method includes steps such as forming a free air ball from a wire tail, determining positional differences of the bonding tool, and measuring the free air ball size based on these differences.
Another significant patent is the "Method and system for pull testing of wire bonds." This method outlines a procedure for pull testing a wire bond, which includes bonding a wire to a conductive surface, clamping the wire, applying a predetermined pulling force, and detecting whether the electrical circuit is open. If the circuit is open, it indicates a bond failure, and the method automatically increments a bond failure count.
Career Highlights
Yi Bin Wang is currently employed at Asm Technology Singapore Pte Ltd, where he continues to develop innovative solutions in wire bonding technology. His work has significantly impacted the efficiency and reliability of wire bonding processes in the semiconductor industry.
Collaborations
He collaborates with talented coworkers, including Keng Yew Song and Qing Le Tan, contributing to a dynamic and innovative work environment.
Conclusion
Yi Bin Wang's contributions to wire bonding technology through his patents and work at Asm Technology Singapore Pte Ltd highlight his role as a key innovator in the field. His inventions continue to advance the capabilities of wire bonding processes, ensuring greater reliability and efficiency in semiconductor manufacturing.