Ipoh, Malaysia

Yew Mun Chan

This inventor holds 1 USPTO granted patent. Top assignee: Altera Corporation. Active years: 2017.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yew Mun Chan. Retrieved from https://idiyas.com/inventor/yew-mun-chan

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2017

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1 patent (USPTO):Explore Patents

Title: Yew Mun Chan and Integrated Circuit Die Selection

Introduction

Yew Mun Chan is an inventor associated with Ipoh, Malaysia, and Altera Corporation. His patent work concerns methods for identifying integrated circuit dies that meet specified performance criteria.

Latest Patents

Chan is credited with 1 patent: “Methods for Selecting Integrated Circuit Dies Based on Pre-Determined Criteria.” The disclosed method uses binning tools to characterize integrated circuit dies according to performance attributes and labels each die with an identifier corresponding to its location in a storage structure. A user can enter a performance description into testing equipment, which retrieves matching identifiers and directs a tester to screen the corresponding physical die locations.

Career Highlights

Chan’s listed invention addresses the selection of integrated circuit dies based on predetermined performance requirements. The approach connects performance grading, die-location identifiers, and tester screening to help locate dies that match a user’s criteria.

Collaborations

Chan’s listed coworkers include Azni Abd Rahman and Teng Chow Ooi. His patent is associated with Altera Corporation.

Conclusion

Yew Mun Chan’s patent describes a structured method for finding integrated circuit dies that meet specified performance criteria, linking die characterization and storage information with targeted testing.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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