Sejong, South Korea

Yeung In Kim

This inventor holds 1 USPTO granted patent. Top assignee: Cepla Co., Ltd.. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yeung In Kim. Retrieved from https://idiyas.com/inventor/yeung-in-kim

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 11.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Yeung In Kim: Innovator in Thermoplastic Resin Composition

Introduction

Yeung In Kim is a notable inventor based in Sejong, South Korea. He has made significant contributions to the field of materials science, particularly in the development of innovative thermoplastic resin compositions.

Latest Patents

Yeung In Kim holds a patent for a non-painted thermoplastic resin composition comprising viscose rayon, which is capable of embodying a marble pattern. This invention minimizes the deterioration of physical properties while reducing weld lines and flow marks during the extrusion process. The composition includes 80-90 parts by weight of a thermoplastic resin, 0.1-5 parts by weight of carbon fiber, and 0.1-3 parts by weight of viscose rayon. The inclusion of viscose rayon enhances the luxurious appearance of the marble pattern without the need for additional post-processing or painting.

Career Highlights

Yeung In Kim is associated with Cepla Co., Ltd., where he continues to innovate in the field of thermoplastic materials. His work has garnered attention for its practical applications and aesthetic qualities.

Collaborations

He collaborates with talented coworkers, including Dae Keun Kim and Jin Young Huh, who contribute to the advancement of their projects.

Conclusion

Yeung In Kim's innovative work in thermoplastic resin compositions showcases his commitment to enhancing material properties and aesthetics in manufacturing. His contributions are paving the way for future advancements in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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