Yeung Au

Title: Innovations of Yeung Au in Integrated Circuit Technology

Introduction

Yeung Au is a notable inventor based in Belmont, MA, who has made significant contributions to the field of integrated circuit technology. With a total of three patents to his name, his work focuses on enhancing the reliability and performance of interconnect structures in integrated circuits.

Latest Patents

One of Yeung Au's latest patents is centered around self-aligned barrier and capping layers for interconnects. This invention provides an interconnect structure for integrated circuits that utilizes copper wires. The patent describes a layer containing manganese (Mn), chromium (Cr), or vanadium (V) that acts as a barrier against copper diffusion, thereby protecting the insulator from premature breakdown and safeguarding transistors from degradation caused by copper. This layer also promotes strong adhesion between copper and insulators, preserving the mechanical integrity of devices during manufacturing and use. Additionally, it protects against failure due to electromigration of copper and corrosion from environmental factors such as oxygen or water. The invention includes methods for selectively depositing Mn, Cr, V, or cobalt (Co) on copper surfaces while minimizing deposition on insulator surfaces. Furthermore, it introduces catalytic deposition of copper using a Mn, Cr, or V containing precursor along with an iodine or bromine containing precursor.

Career Highlights

Yeung Au is affiliated with Harvard College, where he continues to advance his research and innovations in integrated circuit technology. His work has been instrumental in developing methods that enhance the performance and reliability of electronic devices.

Collaborations

Some of Yeung Au's notable coworkers include Roy Gerald Gordon and Harish B Bhandari, who have collaborated with him on various projects related to his patents.

Conclusion

Yeung Au's contributions to integrated circuit technology through his innovative patents demonstrate his commitment to improving electronic device performance and reliability. His work continues to influence the field and pave the way for future advancements.