This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2025.
Company Filing History:
Years Active: 2025
Title: Yeonjoo Kim: Innovator in Semiconductor Packaging
Introduction
Yeonjoo Kim is a prominent inventor based in Seoul, South Korea. He has made significant contributions to the field of semiconductor packaging, showcasing his expertise through innovative designs and solutions.
Latest Patents
Yeonjoo Kim holds a patent for a semiconductor package. This invention includes a base substrate, an interposer package disposed on the base substrate, and first and second semiconductor chips placed on the interposer package. The interposer package features a first redistribution layer, a bridge chip that includes a bridge circuit, and a vertical connection structure with multiple wiring layers. Each of the semiconductor chips is electrically connected to the bridge circuit and the wiring layers through the first redistribution layer. This patent highlights his ability to enhance semiconductor technology.
Career Highlights
Yeonjoo Kim is currently employed at Samsung Electronics Co., Ltd., a leading company in the electronics industry. His work at Samsung has allowed him to be at the forefront of technological advancements in semiconductor packaging.
Collaborations
Some of his notable coworkers include Hongwon Kim and Junmo Koo, who contribute to the innovative environment at Samsung Electronics.
Conclusion
Yeonjoo Kim's contributions to semiconductor packaging demonstrate his innovative spirit and technical expertise. His patent reflects the ongoing advancements in technology that are essential for the future of electronics.